Known Good Die Virtual Workshop
Thank you to attendees, sponsors, and presenters that made KGD 2020 an outstanding event!
|Wednesday||September 16, 2020||8:00 - 10:00 am PDT|
|Thursday||September 17, 2020||8:00 - 10:00 am PDT|
|Friday||September 18, 2020||8:00 - 10:30 am PDT|
KGD Powering More than Moore!
With the demise of Moore’s Law due to the economics of advanced semiconductor process nodes, the demand for greater cost performance and differentiation has fueled the development of advanced packaging. Having Known Good Die (KGD) is essential for many, if not all, of the current ‘crop’ of advanced semiconductor packaging.
Join us at the 20th annual Known Good Die Workshop on September 16 - 18, 2020 for a cross-functional view of challenges and solutions for achieving KGD!
Wednesday September 16, 2020
Keynote - Making KGD silicon work in your supply chain
The slowdown of Moore’s Law scaling has accelerated the adoption of advanced packaging and ‘Known Good Die’ silicon. Although most industry presentations focus on the technologies and business cases involved, there is evidence that working cultures throughout the supply chain will need to evolve as well in this new era. Foundries, component suppliers and OSATs will not be able to rely only on their historical strengths as our industry changes. We’ll examine leading-edge products that contain examples of these trends and discuss some surprising initiatives that were required for those products to achieve overall success in high-volume production.
Thursday September 17, 2020
Friday September 18, 2020
Program subject to change without notice.
ASE is the global leader in advanced semiconductor packaging & test, and at the forefront of flexible, powerful integration technologies that achieve criteria for improved power, performance, area, and cost requirements. Our comprehensive toolbox leveraging innovative technologies, such as die interconnection, wafer level fan out, embedded devices, conformal and compartmental shielding, integrated antenna, and others, are constantly being refined and enhanced to support next generations of system integration.
ASE believes that innovation is everything. Our industry is driven by innovation, and through ASE's integration and miniaturization technologies, we are enabling transformative solutions that are changing lives, from health to transportation, from Robotics to AI, from IoT to 5G. ASE is proud to be part of these advancements and we look forward to working with you to create a smarter and more sustainable world.
You are cordially invited to learn about more about how we can help enable and collaborate in your innovation: please contact Patricia MacLeod
Mühlbauer is a global, independent consultant and manufacturer of turnkey automation solutions for the Smart Card, RFID Smart Label, Semiconductor Backend, Flexible Solar Cell manufacturing and Vision industries. In addition, the company is active in the areas of enrollment and verification of personal data, precision parts and OEM production. With more than 3000 employees in 25 locations on five continents, Mühlbauer is a leading supplier of Flip Chip & Die Sorting- and Bonding equipment for the Semiconductor Backend applications. Mühlbauer specializes in the area of high-volume reel-to-reel production solutions for medical and other wearables applications.
Amkor Technology is one of the world’s largest providers of high-quality semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test and is a strategic manufacturing partner for the world’s leading semiconductor companies, foundries and electronics OEMs. Amkor’s broad package portfolio offers our customers semiconductor solutions to enable 5G, AI, Automotive, Communications, Computing, Consumer, Industrial, IoT and Networking products.
Services include package design and development, wafer probe and package test, wafer bumping and redistribution, package assembly and final test. Engineering services offer best-in-class thermal, electrical and mechanical modeling and characterization as well as design automation. Test engineering services range from test program development to full product characterization of packaged RF, mixed signal, logic and memory devices.
Amkor’s operational base includes production facilities, product development centers and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the US.
MicroCircuit Laboratories (MCL) is the industry process expert for seam weld and seam AuSn hermetic package cover sealing. Our services range from development to problem resolution and production, with deliverables tailored to your specific needs. All sealing processes far exceed industry specifications and are backed by a lifetime warranty.