KGD Workshop 2020

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Known Good Die Virtual Workshop



Join us for three online sessions
Wednesday September 16, 2020 8:00 - 10:00 am PDT
Thursday September 17, 2020 8:00 - 10:00 am PDT
Friday September 18, 2020 8:00 - 10:30 am PDT


Event registration is free courtesy of our sponsors

Registration

KGD Powering More than Moore!

With the demise of Moore’s Law due to the economics of advanced semiconductor process nodes, the demand for greater cost performance and differentiation has fueled the development of advanced packaging. Having Known Good Die (KGD) is essential for many, if not all, of the current ‘crop’ of advanced semiconductor packaging.

Join us at the 20th annual Known Good Die Workshop on  September 16 - 18, 2020 for a cross-functional view of challenges and solutions for achieving KGD!

Wednesday September 16, 2020


8:00 a

The Need


 
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Opening Remarks

Ira Feldman
MEPTEC
 
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Keynote - Making KGD silicon work in your supply chain

David Greenlaw
Nvidia

The slowdown of Moore’s Law scaling has accelerated the adoption of advanced packaging and ‘Known Good Die’ silicon. Although most industry presentations focus on the technologies and business cases involved, there is evidence that working cultures throughout the supply chain will need to evolve as well in this new era. Foundries, component suppliers and OSATs will not be able to rely only on their historical strengths as our industry changes. We’ll examine leading-edge products that contain examples of these trends and discuss some surprising initiatives that were required for those products to achieve overall success in high-volume production.


 
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End to End Data

Yuri MItnick & Zoe Conroy
Cisco


10:00 a

Adjourn


Thursday September 17, 2020


8:00 a

The Strategy



 
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Advanced Packaging Failure Analysis Challenges

Bernice Zee
AMD
 
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Shift Left

David Armstrong
Advantest
 
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TBA

Bob Patti
NHanced Semiconductors, Inc.

10:00 a

Adjourn


Friday September 18, 2020


8:00 a

The Solutions



 
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After 30 Years Why Are We Still Talking about Known Good Die?


Jan Vardaman
Techsearch International

 
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Improving SiP Quality and Reducing Cost Through the Use of Machine Learning and Predictive Analytics

Jeff David
PDF Solutions
 
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Die Sorting & Inspection

Gerald Steinwasser
Muhlbauer
 
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Die Crack Prevention and Detection in Advanced Packaging
Woo Young Han
Onto Innovation


10:30 a

Adjourn

Event registration is free courtesy of our sponsors

Registration

Program Subject to Change Without Notice