KGD Workshop 2020

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Known Good Die Virtual Workshop



Thank you to attendees, sponsors, and presenters that made KGD 2020 an outstanding event!

Held as three online sessions
Wednesday September 16, 2020 8:00 - 10:00 am PDT
Thursday September 17, 2020 8:00 - 10:00 am PDT
Friday September 18, 2020 8:00 - 10:30 am PDT


Event registration is free courtesy of our sponsors


KGD Powering More than Moore!

With the demise of Moore’s Law due to the economics of advanced semiconductor process nodes, the demand for greater cost performance and differentiation has fueled the development of advanced packaging. Having Known Good Die (KGD) is essential for many, if not all, of the current ‘crop’ of advanced semiconductor packaging.

Join us at the 20th annual Known Good Die Workshop on  September 16 - 18, 2020 for a cross-functional view of challenges and solutions for achieving KGD!

Wednesday September 16, 2020


8:00 a

The Need


 
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Opening Remarks

Ira Feldman
MEPTEC
 
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Keynote - Making KGD silicon work in your supply chain

David Greenlaw
Nvidia

The slowdown of Moore’s Law scaling has accelerated the adoption of advanced packaging and ‘Known Good Die’ silicon. Although most industry presentations focus on the technologies and business cases involved, there is evidence that working cultures throughout the supply chain will need to evolve as well in this new era. Foundries, component suppliers and OSATs will not be able to rely only on their historical strengths as our industry changes. We’ll examine leading-edge products that contain examples of these trends and discuss some surprising initiatives that were required for those products to achieve overall success in high-volume production.


 
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End to End Data

Yuri MItnick & Zoe Conroy
Cisco


10:00 a

Adjourn


Thursday September 17, 2020


8:00 a

The Strategy



 
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Advanced Packaging Failure Analysis Challenges

Bernice Zee
AMD
 
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Shift Left

David Armstrong
Advantest
 
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Known Not Bad Die Success:
Repair, Redundancy, and Pragmatism

Bob Patti
NHanced Semiconductors, Inc.

10:00 a

Adjourn


Friday September 18, 2020


8:00 a

The Solutions



 
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After 30 Years Why Are We Still Talking about Known Good Die?


Jan Vardaman
Techsearch International

 
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Improving SiP Quality and Reducing Cost Through the Use of Machine Learning and Predictive Analytics

Jeff David
PDF Solutions
 
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Die Sorting & Inspection

Gerald Steinwasser
Muhlbauer
 
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Die Crack Prevention and Detection in Advanced Packaging
Woo Young Han
Onto Innovation


10:30 a

Adjourn

 
 
 
Event registration is free courtesy of our sponsors


Program subject to change without notice.

Sponsor Directory

Please thank our sponsors who have made this event possible!



Diamond Sponsor


ASE Group Logo

ASE is the global leader in advanced semiconductor packaging & test, and at the forefront of flexible, powerful integration technologies that achieve criteria for improved power, performance, area, and cost requirements. Our comprehensive toolbox leveraging innovative technologies, such as die interconnection, wafer level fan out, embedded devices, conformal and compartmental shielding, integrated antenna, and others, are constantly being refined and enhanced to support next generations of system integration.

ASE believes that innovation is everything. Our industry is driven by innovation, and through ASE's integration and miniaturization technologies, we are enabling transformative solutions that are changing lives, from health to transportation, from Robotics to AI, from IoT to 5G. ASE is proud to be part of these advancements and we look forward to working with you to create a smarter and more sustainable world.

You are cordially invited to learn about more about how we can help enable and collaborate in your innovation: please contact Patricia MacLeod


Emerald Sponsors


Advantest logo
Advantest is the leading manufacturer of automatic test and measurement equipment used in the design and production of semiconductors for applications including 5G communications, the Internet of Things (IoT), autonomous vehicles, artificial intelligence (AI), machine learning, smart medical devices and more. Its leading-edge systems and products are integrated into the most advanced semiconductor production lines in the world. The company also conducts R&D to address emerging testing challenges, produces multi-vision metrology scanning electron microscopes essential to photomask manufacturing, and offers groundbreaking 3D imaging and analysis tools. Founded in Tokyo in 1954, Advantest is a global company with facilities around the world and an international commitment to sustainable practices and social responsibility.
Gel-Pak Logo
For more than 40 years Gel-Pak has provided a family of products that ensure the safe shipping, handling and processing of valuable semiconductor and photonic devices. Our pocketless boxes, trays, slides and films use a proprietary elastomer technology to hold devices in place without the use of custom molded pockets. Devices carriers can be used for both manual and automated pick-and-place applications. For more unique device handling challenges, Gel-Pak’s world-class R&D team works with customers to develop solutions that meet the demands of their specific application.

Muhlbauer logo

Mühlbauer is a global, independent consultant and manufacturer of turnkey automation solutions for the Smart Card, RFID Smart Label, Semiconductor Backend, Flexible Solar Cell manufacturing and Vision industries. In addition, the company is active in the areas of enrollment and verification of personal data, precision parts and OEM production. With more than 3000 employees in 25 locations on five continents, Mühlbauer is a leading supplier of Flip Chip & Die Sorting- and Bonding equipment for the Semiconductor Backend applications. Mühlbauer specializes in the area of high-volume reel-to-reel production solutions for medical and other wearables applications.


Sapphire Sponsor


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Amkor Technology is one of the world’s largest providers of high-quality semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test and is a strategic manufacturing partner for the world’s leading semiconductor companies, foundries and electronics OEMs. Amkor’s broad package portfolio offers our customers semiconductor solutions to enable 5G, AI, Automotive, Communications, Computing, Consumer, Industrial, IoT and Networking products.

Services include package design and development, wafer probe and package test, wafer bumping and redistribution, package assembly and final test. Engineering services offer best-in-class thermal, electrical and mechanical modeling and characterization as well as design automation. Test engineering services range from test program development to full product characterization of packaged RF, mixed signal, logic and memory devices.

Amkor’s operational base includes production facilities, product development centers and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the US.


Ruby Sponsor


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MicroCircuit Laboratories (MCL) is the industry process expert for seam weld and seam AuSn hermetic package cover sealing. Our services range from development to problem resolution and production, with deliverables tailored to your specific needs. All sealing processes far exceed industry specifications and are backed by a lifetime warranty.